Charge coupled device package with glass lid

ABSTRACT

A charge coupled device package with a glass lid is provided. The package includes a charge coupled device having a plurality of conductive bumps on its bond pads, an insulating tape bonded to the inside of the conductive bumps on the charge coupled device, a plurality of metal lines each connected at an end thereof to each of the conductive bumps and at the outer end thereof to a signal terminal of a circuit board and adapted for transmitting an electric signal of the charge coupled device to the outside, and a glass lid provided with the plurality of metal lines on opposite sides of its lower surface and bonded to an upper surface of the insulating tape on the charge coupled device. The sealing part of a sealing resin is provided between a lower periphery of the glass lid and an upper surface of the charge coupled device. This charge coupled device package reduces the package weight as well as the package thickness and thus achieves the recent trend of lightness and compactness of an integrated camera and video cassette recorder system.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates in general to a charge coupled devicepackage used in electric equipment, such as an integrated camera andvideo cassette system, and more particularly to a charge coupled devicepackage with a glass lid, which is covered with and sealed by the glasslid which lid is capable of transmitting an image light to a lightreception part of a charge coupled device.

2. Description of the Related Art

With reference to FIG. 1, there is shown a known charge coupled devicepackage with a glass lid where the glass lid of a predetermined sizecovers and seals a charge coupled device, Here, as well known to thoseskilled in the art, the charge coupled device is used to convert animage light into an electric signal. The known charge coupled devicepackage with a glass lid (hereinafter, referred to simply as "the glasslid type CCD package") includes a ceramic package having a ceramic bodyor a package body 4 provided with a cavity 4a of a predetermineddiameter and a predetermined depth. In order to manufacture the ceramicpackage, a plurality of metal lines or lead fingers 5 are arranged onthe package body 4 at opposite sides of the cavity 4a such that the leadfingers 5 are spaced apart from each other by a predetermined interval.Thereafter, a ceramic layer, having a predetermined thickness and apredetermined width, is applied on the lead fingers 5 on each of thesides of the package body 4 prior to burning the package body 4.

A plurality of outleads 6 are connected to outer ends of individual leadfingers 5. The outleads 6 are also connected to the opposite side wallsof the package body 4 through bra-Ting metals 6' respectively. Thecharge coupled device 1 (hereinafter, referred to simply as "the CCD"),having a light reception part 1a on its upper center, is bonded to theupper center of the cavity 4a of the CCD package body 4. The CCD 1 isalso provided on its opposite sides with a plurality of bond pads 2,each of which is connected to an inner end of each of the lead fingers 5by a metal wire 3. The package body 4 is covered with and sealed by aglass lid 7 through which an outside image light is transmitted to thelight reception part la of the CCD 1.

In order to bond the glass lid 7 to the package body 4, a bonding agenthaving a lower melting point is conventionally used.

In application, the known glass lid type CCD package is mounted on acircuit board (not shown) such that the outleads 6 of the package areconnected to signal terminals of a signal processing circuit (not shown)of the circuit board and conventionally used as an optical element ofelectronic equipment, particularly of an integrated camera and videocassette recorder system, a so-called camcorder. In operation, theoptical image light from the camera lens is transmitted through theglass lid 7 and received by the light reception part 1a of the CCD 1.Upon reception of the image light, the CCD 1 converts the image lightinto an appropriate electric signal which is in turn outputted to thesignal processing circuit through the bond pads 2 of the CCD 1, themetal wires 3, the lead fingers 5 and the outleads 6 in this order.

In the drawing, the reference numeral 9 denotes a bonding part forbonding the CCD 1 to the bottom surface of the cavity 4a of the packagebody 4.

Turning to FIG. 2, there is shown a flowchart of a process formanufacturing the known glass lid type CCD package. In order tomanufacture the known glass lid type CCD package, a wafer forming step110 of the ceramic package body 4 is first carried out. The package body4 is formed such that it has the cavity 4a on its upper surface. Theplurality of lead fingers 5 are, thereafter, arranged on the packagebody 4 at the opposite sides of the cavity 4a and applied with theceramic layer, having the predetermined thickness and the predeterminedwidth, thereby producing the package body 4. This package body formingstep is followed by a die attaching step 130 wherein the CCD 1, preparedby the step 120 of sawing the wafer, is bonded to the center of thebottom surface of the cavity 4a of the package body 4. Thereafter, theplurality of the bond pads 2 of the CCD 1 are connected to the innerends of the lead fingers 5 through the metal wires 3, respectively,thereby accomplishing a wire bonding step 140. The wire bonding step 140is followed by a glass lid sealing step 150 wherein the glass lid 7 isbonded to the upper surface of the package body 4 to seal the cavity 4a.The process for manufacturing the glass lid type CCD package furtherincludes a trimming step 160 and a marking step 170 which are performedin this order after the glass lid sealing step 150. Here, a green tapeforming and a screen printing are carried out in this order to arrangethe lead fingers 5 on the package body 4.

As noted from the above description, in manufacturing the known glasslid type CCD package, it is required to form the package body using theceramic material while arranging the plurality of metal lines or thelead fingers on predetermined positions of the package body. Also, theplurality of outlands should be bonded to the opposite side walls of thepackage body and connected to the outer ends of the lead fingers afterthe burning of the package body, respectively. Thus, the known glass lidtype CCD package has a problem in that it requires a complexmanufacturing process, involves a larger capital investment and requiresa longer manufacturing time, so that it is not suitable for massproduction.

In addition, the known glass lid type CCD package requires a criticalcleanness control in its manufacturing process since it has the CCD,adapted for converting the image light into the electric signal, therebyrequiring good care in assembling the semiconductor device. Anotherproblem of the known glass lid type CCD package is that it does notachieve the recent trend of compactness of the semiconductor device.Furthermore, the known glass lid type CCD package is limited in reducinga lead pitch (presently reduced to 50 mil) of its outleads, therebyproviding no semiconductor device having a fine pitch.

SUMMARY OF THE INVENTION

It is, therefore, an object of the present invention to provide a chargecoupled device package with a glass lid in which the aforementionedproblems can be overcome wherein the recent trend of compactness isachieved and its manufacturing process is simplified and is, therebysuitable for mass production.

It is another object of the present invention to provide a chargecoupled device package with a glass lid which remarkably reduces thelead pitch of its outleads, thereby providing a semiconductor devicehaving a fine pitch.

To accomplish the above objects, a charge coupled device package with aglass lid in accordance with an embodiment of the present inventioncomprises: a charge coupled device, provided with a plurality ofconductive bumps on its individual bond pads; an insulating tape, havinga predetermined thickness and a predetermined width and bonded to theinside of the conductive bumps on the charge coupled device; a pluralityof metal lines, each connected at an end thereof to each of theconductive bumps and at the other end thereof to a signal terminal of acircuit board and adapted for transmitting an electric signal of thecharge coupled device to the outside therethrough; and a glass lid,provided on opposite sides of its lower surface with the plurality ofmetal lines and mounted above the charge coupled device, and bonded tothe upper surface of the insulating tape.

The above charge coupled device package with a glass lid is manufacturedby a process comprising the steps of: forming a conductive bump on eachof the plurality of bond pads of the charge coupled device; bonding adouble-faced insulating tape, having a window frame shape and of apredetermined thickness and a predetermined width, to the inside of theconductive bumps; bonding a glass lid, provided with a plurality ofmetal lines on opposite sides of its lower surface, to an upper surfaceof the insulating tape; and electrically connecting end of each of themetal lines to each of the conductive bumps; and encapsulating thecharge coupled device by applying a sealing resin to a gap between thelower periphery of the glass lid and the upper surface of the chargecoupled device.

Thereafter, the circuit board, on which the charge coupled devicepackage of the present invention is to be mounted, is formed with amounting depression at a predetermined position. The charge coupleddevice package is inserted into the mounting depression, and thereafter,the outer ends of the metal lines, exposed to the outside from the lowersurface of the glass lid, are electrically connected to signal terminalsof the circuit board, respectively, thereby achieving the mounting ofthe charge coupled device package on the circuit board.

In operation, an optical image light from a camera lens is transmittedthrough the glass lid and received by a light reception part of thecharge coupled device of the package. Upon reception of the image light,the charge coupled device converts the image light into an appropriateelectric signal which is in turn outputted to a signal processingcircuit of the circuit board through the bond pads of the charge coupleddevice, the conductive bumps, and the metal lines under the glass lid inthis order.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and other advantages of thepresent invention will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a cross-sectional view showing a construction of a chargecoupled device package with a glass lid according to the conventionalart;

FIG. 2 is a flowchart of a process for manufacture of the conventionalcharge coupled device package with a glass lid;

FIG. 3A is an exploded perspective view showing a construction of acharge coupled device package with a glass lid according to anembodiment of the present invention;

FIG. 3B is a cross-sectional view of the charge coupled device packageof FIG. 3A after assembled;

FIG. 4 is a cross-sectional view showing the charge coupled devicepackage of FIG. 3B, mounted on a circuit board while being inserted in amounting depression of the circuit board;

FIG. 5 is a flowchart showing a process for manufacture and surfacemounting of the charge coupled device package with the glass lid for anembodiment of the present invention; and

FIG. 6 is a cross-sectional view showing a charge coupled device packagewith a glass lid in accordance with another embodiment of the presentinvention, mounted on a circuit board without a mounting depression.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

With reference to the drawings, FIGS. 3A and 3B show a charge coupleddevice package with a glass lid in accordance with an embodiment of thepresent invention, FIG. 4 shows the charge coupled device packagemounted on a circuit board having a mounting depression, and FIG. 5 is aflowchart of a process for manufacture of the charge coupled devicepackage for an embodiment of the present invention. The charge coupleddevice package with the glass lid (hereinafter, referred to simply as"the glass lid type CCD package") includes a charge coupled device 12,which has a width W₁ and is provided with a conductive bump 11 on eachof its bond pads. A window frame-shaped and double-faced insulating tape15, having a predetermined thickness and a predetermined width, isbonded to the inside of the plurality of conductive bumps 11 on thecharge coupled device 12. The glass lid type CCD package furtherincludes a plurality of metal lines 13, each connected at an end thereofto each of the conductive bumps 11 and at the other end thereof to asignal terminal of a circuit board 16 and adapted for transmitting anelectric signal of the charge coupled device 12 to the outsidetherethrough. In addition, a glass lid 14 is mounted above the chargecoupled device 12. The glass lid 14 is provided at opposite sides of itslower surface with the plurality of metal lines 13 and is bonded to theupper surface of the insulating tape 15.

Here, each of the conductive bumps 11, preferably made of gold or soldershowing an excellent conductivity, is positioned on each of the bondpads (not shown) of the charge coupled device 12 (hereinafter, referredto simply as "the CCD") and has a predetermined height.

In addition, tile metal lines 13 are arranged under the opposite sidesof the glass lid 12 such that they are spaced apart from each other inthe same manner as and by the same interval as the conductive bumps 11.The glass 1 id 14 has a width W, which is larger than that W₁ of the CCD12, so that all of the free ends of the metal lines 13 provided underthe glass lid 14 are exposed to the outside of the opposite sides of theCCD 12. The mounting of the glass lid type CCD package is achieved bymounting the metal lines 13 on the circuit board 16. In mounting theglass lid type CCD package on the circuit board 16, each of the metallines 13 is soldered to a signal terminal (not shown) of the circuitboard 16. In order to prevent reflection of the light by the glass lid14, the glass lid 14 is applied with an anti-reflection coating or ananti-reflection tape on its upper surface.

The insulating tape 15 is adapted for spacing the glass lid 14 from theCCD 12 by a predetermined interval and uses a window frame-shaped tapewhich is sized to cover neither the conductive bumps 11 of the CCD 12nor the metal lines 13 of the glass lid 14.

In order to improve the sealing performance of the glass lid type CCDpackage, an encapsulation of the charge coupled device 12 is carriedout. Otherwise stated, a sealing resin is applied to a gap between thelower periphery of the glass lid 14 and upper surface of the CCD 12,thereby improving the sealing performance between the glass lid 14 andthe CCD 12 as well as the reliability of the CCD package.

In the drawings, the reference numeral 16a denotes a mounting depressionof the circuit board 16 for mounting the glass lid type CCD package onthe circuit board 16.

Turning to FIG. 5, there is shown a flowchart of a process formanufacture of the above glass lid type CCD package. At first, a waferis provided at step 210, and a plurality of conductive bumps 11 areformed on the plurality of bond pads of the wafer, respectively at step220. The wafer is, thereafter, divided into a plurality of CCDs 12 bysawing at seep 230. The doublefaced insulating tape 15, having thepredetermined thickness and the predetermined width, is bonded to theinside of the bond pads 12 of each of the divided CCDs 12. The glass lid14, having a surface area slightly larger than the upper surface area ofthe CCD 12, is provided on opposite sides of its lower surface with theplurality of metal lines 13 at step 240. The glass lid 14 is,thereafter, arranged on the CCD 12 such that the plurality of metallines 13 are aligned with the plurality of conductive bumps 11 of theCCD 12, respectively at step 250. The glass lid 14 is in turn bonded tothe upper surface of the insulating tape 15 on the CCD 12 such thatthere is provided a predetermined space between the glass lid 14 and thelight reception part 12a of the CCD 12. In addition, a flip-chip bondingat step 260 is carried out.

Here, the bonding of the metal lines 13 of the glass lid 14 to theconductive bumps 11 of the CCD 12 is preferably achieved by a localheating method employing hot air or by a reflow method.

The flip-chip bonding is followed by an encapsulation at step 270wherein the sealing resin 17 is applied to the gap between the lowerperiphery of the glass lid 14 are exposed to the outside. As a result,the glass lid type CCD package of FIG. 3B is produced.

In order to mount the glass lid CCD package on the surface of thecircuit board 16, the circuit board 16 is provided with the mountingdepression 16a into which the CCD package is inserted. Thereafter, themetal lines 13 of the CCD package are bonded to the signal terminals(not shown) of the circuit board 16 , respectively, therebyaccomplishing the surface mounting at step 260 of the CCD package on thecircuit board 16.

In operation, the image light from the camera lens (not shown) istransmitted to the light reception part 12a of the CCD 12 through theglass lid 14. Upon reception of the image light, the CCD 12 converts theimage light into the electric signal which is in turn outputted to thesignal terminals of the circuit board 16 through the conductive bumps 11and the metal lines 13.

FIG. 6 shows a second embodiment of a glass lid type CCD package of thepresent invention which is mounted on the circuit board 16 in accordancewith another type of surface mounting. In this second embodiment, theglass lid type CCD package is provided with an additional outlead 19,which is adapted for signal communication and connected to an outer endof each of the metal lines 13 of the glass lid 14. The CCD package ismounted on the surface of the circuit board 16 through the additionaloutleads 19. Each of the outleads 19 is preferably made of copper orFe-Ni alloy and preferably bent in the shape as shown in FIG. 6.However, each of the outleads 19 may be bent in the shape of otherforms, including a gull-form, other than the aforementioned.

This second embodiment of CCD package is simply mounted on the circuitboard 16 by bonding the outer ends of the outleads 19 to a plane surfaceof the circuit board 16. Thus, this CCD package requires no depression16a to be formed on the circuit board differently from the primaryembodiment of FIG. 4, so that it has an advantage of using aconventional plane circuit board.

In the second embodiment, the general shape and the operational effectof the CCD package except for addition of the outleads 19 remain thesame as in the primary embodiment and those elements common to both theprimary embodiment and the second embodiment thus carry the samereference numerals, and further explanation is not deemed necessary.

As described above, the present invention provides a CCD package with aglass lid which requires no conventional ceramic package and has asimple construction, thereby simplifying the manufacturing process,reducing the manufacturing cost, and improving the productivity. The CCDpackage according to the present invention achieves compactness,particularly owing to a remarkable reduction of package weight andpackage thickness. Hence, the CCD package of the present inventionachieves the recent trend of lightness and compactness of electronic andinformation equipment employing semiconductor devices, such as anintegrated camera and video cassette recorder system.

Although the preferred embodiments of the present invention have beendisclosed for illustrative purposes, those skilled in the art willappreciate that various modifications, additions and substitutions arepossible, without departing from the scope and spirit of the inventionas disclosed in the accompanying claims.

What is claimed is:
 1. A charge coupled device package with a glass lidcomprising:a charge coupled device having a plurality of conductivebumps on bond pads of said charge coupled device; an insulating tapehaving a predetermined thickness and a predetermined width and bonded toinside portions of said conductive bumps on said charge coupled device;and a glass lid having a plurality of metal lines on opposite sides of alower surface thereof and bonded to an upper surface of said insulatingtape such that each metal line is electrically connected at one end to arespective one of said conductive bumps and at the other end thereof isadapted to be electrically coupled to a signal terminal of a circuitboard.
 2. The charge coupled device package with a glass lid accordingto claim 1, further including sealing resin provided between a lowerperiphery of the glass lid and an upper surface of said charge coupleddevice.
 3. The charge coupled device package with a glass lid accordingto claim 1, wherein the glass lid is provided with an anti-reflectionlayer on an upper surface thereof for prevention of light reflection. 4.A charge coupled device package with a glass lid according to claim 1,further comprising a plurality of outleads which are adapted for signalcommunication and are connected to outer ends of said metal lines,respectively.
 5. A method for manufacturing a charge coupled devicepackage with a glass lid, comprising the steps of:(a) forming aplurality of conductive bumps on a plurality of bond pads of a chargecoupled device; (b) bonding an insulating tape of a predeterminedthickness and a predetermined width to inside portions of saidconductive bumps on said charge coupled device; (c) bonding a glass lidhaving a plurality of metal lines on opposite sides of a lower surfacethereof to an upper surface of said insulating tape; wherein saidplurality of metal lines are configured such that each metal linecontacts, at one end thereof, one of said conductive bumps and, at theother end thereof, is adapted to be electrically coupled to a signalterminal of a circuit board.
 6. A method for manufacturing a chargecoupled device package with a glass lid according to claim 5, furthercomprising the step of providing a sealing part of a sealing resinbetween a lower periphery of the glass lid and an upper surface of saidcharge coupled device.
 7. A method for manufacturing a charge coupleddevice package with a glass lid according to claim 5, further comprisingthe step of providing an anti-reflection layer on an upper surface ofthe glass lid for preventing light reflection.
 8. A method formanufacturing a charge coupled device package with a glass lid accordingto claim 5, further comprising the step of connecting a plurality ofoutleads, adapted for signal communication, to outer ends of said metallines, respectively.